Wakilin Tsabtace Na'ura mai ƙarfi don PCBA

a)  Ingantaccen tsaftacewa da garantin yawan amfanin ƙasa

• Yawan amfanin samfurin bayan tsaftacewa zai iya kaiwa 99.9%, yana rage lahani sosai kamar gajeriyar da'ira da lalata ta hanyar gurɓatawa.

• Bayan tsaftacewa, ragowar datti suna kwashe ta atomatik kuma a nutse zuwa kasa, guje wa gurɓataccen gurɓataccen abu da kuma tsawaita rayuwar sabis na maganin tsaftacewa.

b)  Siffofin kare muhalli

• Tsarin samarwa da maganin sharar ruwa ba su da fitarwar gurɓatawa. Wannan dabarar ba za ta iya lalacewa ba, yana rage nauyi na dogon lokaci akan muhalli.

• Yarda da RoHS: Tsaya bin umarnin RoHS na EU don tabbatar da cewa wakili mai tsaftacewa bai ƙunshi abubuwa masu cutarwa kamar gubar da cadmium ba.

c)  Amintaccen kayan aiki

• Babu lalata ga abubuwan PCBA (kamar foil na jan karfe, kayan haɗin gwiwa, da abubuwan haɗin gwiwa), yana tabbatar da amincin da'ira na dogon lokaci.

• Fuskar ta kasance ba canzawa a launi kuma baya juya fari bayan tsaftacewa, kiyaye daidaiton bayyanar samfurin da aiki.

d)  Tsaro

• Babu alamun filasha da ke kawar da ɓoyayyun haɗarin konewa da fashewar da ke haifar da babban zafin jiki ko kuma tsayayyen wutar lantarki.

• Ba a buƙatar kayan aikin fashewa na musamman yayin aikin aiki, rage farashin kula da tsaro.

a) Masana'antar Lantarki na Mabukaci (High Precision & Miniaturization)

An tsara shi don allunan kewayawa na FPC da 0.3mm-pitch BGA marufi a cikin wayoyi da belun kunne na TWS, wannan mai tsabtacewa yana kawar da ragowar ionic da fashewar fashewa a kusa da haɗin gwiwar micro solder. Mai jituwa tare da SIP (System-in-Package) kwakwalwan kwamfuta' hadaddun tsarin, yana kawar da tsaftace wuraren makafi da ke haifar da tasirin capillary, yana tabbatar da> 99.8% yawan amfanin ƙasa don abubuwan haɓaka mai girma kamar 5G RF modules.

b) Kayan Wutar Lantarki na Masana'antu & Motoci (Maɗaukakin Ƙarfi & Dorewa)

Mafi dacewa ga nau'ikan IGBT da ma'aunin yumbura na DCB a cikin EV powertrains, yana saurin lalata man siliki mai ƙarfi mai ƙarfi da ragowar kayan solder na Ag-sintering yayin da yake kare yadudduka na jan karfe da Al₂O₃ / AlN substrates daga lalata. Ingantattun gwaje-gwajen hawan keke na 150 ℃, ya haɗu da amincin na'urorin wutar lantarki na dogon lokaci a ƙarƙashin matsanancin yanayin zafi.

c) Babban Marufi & Semiconductors (Kariyar Tsarin Tsari)

Wanda aka keɓance don FCBGA (Flip-Chip Ball Grid Array) da marufi na 2.5D/3D, ƙirarta mai ƙarancin-tsayi tana ratsa gibin ƙananan-bump (μbump), tare da cire cikar cikas da ɓarna mai jujjuyawar carbonized. TSV (Ta hanyar Silicon Via) mai jituwa, yana hana haɗarin ƙaura na lantarki wanda ya haifar da ragowar riƙewar ruwa.

d) Likita & Jirgin Sama (Zero-Defect & Compliance)

Mai bin ka'idodin MIL-PRF-28809F da ka'idodin ISO 13485, yana samun gogewa-matakin tsaftacewa don PCBs masu bugun zuciya da allunan sarrafa jirgin sama. Silicone/Plasticizer-free dabara wuce <10ppm ionic sauran gwaje-gwaje, tabbatar da sifili lalacewa a cikin high-oxygen/vacuum muhallin.

a) Cleaning aiki : The al'ada tsaftacewa zafin jiki ne sarrafawa a 50-60 ℃, da kuma tsaftacewa lokaci ne 1-10 minti. Don taurin mai taurin kai, ana iya tsawaita lokacin da ya dace.

b) Kula da kayan aiki : A kai a kai tsaftace laka a cikin ruwan tanki. Ana ba da shawarar a sanye shi da na'urar tacewa mai kewayawa don inganta tasirin tsaftacewa.

c) Jiyya na samfur : Don samfuran madaidaicin madaidaicin, ana ba da shawarar yin amfani da kayan aikin feshi ko kayan aikin ultrasonic mai ƙarfi don guje wa lalacewar samfuran da ke haifar da girgizar ultrasonic na yau da kullun.

d) Marufi : Kunshe a cikin ganguna na filastik 25L/200L. Yana da samfur mara haɗari, wanda ya dace don ajiya da sufuri.

e) Adana da sufuri : Lokacin ajiya shine shekaru 2. Ana buƙatar adana shi a cikin gida don guje wa rana da ruwan sama. Don abubuwan tsaftacewa da ba a yi amfani da su ba, matsa hular ganga don hana danshi da ƙazanta daga haɗuwa a ciki.