| Availability: | |
|---|---|
| Quantity: | |
SPC-201A
Yuanan
SPC-201A is a specialized, water-based weak alkaline pre-cleaner engineered for advanced large-format and ultra-thin solar wafers in modern Diamond Wire Sawing (DWS) processes. Formulated with a mild alkaline system and advanced dispersion technology, it effectively strips residual ingot bonding adhesives and concentrated coolants without over-etching the fragile substrates. By removing 99% of heavy organic contaminants at the pre-cleaning stage, SPC-201A prevents severe nozzle clogging in high-volume production lines and provides a pristine foundation for subsequent fine cleaning and texturing processes.
Powered by an advanced surfactant system, it quickly dissolves stubborn ingot bonding adhesives and breaks down the high-viscosity cooling fluids used in high-speed DWS cutting, enabling higher production throughput.
Effectively suspends silicon powder to prevent sedimentation and redeposition. This completely eliminates nozzle blockage, reducing unplanned maintenance frequency by up to 30%.
The non-corrosive, fluoride-free formulation protects stainless steel tanks and internal piping, extending the service life of automated cleaning tools while significantly simplifying wastewater pre-treatment.
Maintains consistent cleaning performance for an extended bath life of 15-25 days. With routine replenishment of only 0.5%-1.0% stock solution, it drastically lowers chemical consumption and the total cost of ownership (TCO).
The mild, controlled formulation prevents micro-cracks and surface damage on fragile, ultra-thin substrates (<150μm) during high-throughput cleaning of large-format solar wafers.
Basic Parameters | |
Product Model | SPC-201A |
Appearance | Clear Liquid |
pH (Working Solution) | 9.3 – 9.7 |
Dilution Ratio | 1:10 – 1:15 (6% – 10% concentration) |
Flash Point | Non-flammable |
Performance Parameters | |
Applicable Substrates | Monocrystalline/Polycrystalline PV Wafers |
Wafer Specifications | Large-format (182/210mm+), Ultra-thin (<150μm) |
Operating Temperature | 35 – 55℃ (Recommended: 45℃) |
Cleaning Time | 4 – 8 minutes |
Bath Replacement Cycle | 15 – 25 days (continuous production) |
Compliance Supplement | Fluoride-free, non-corrosive formulation |
SPC-201A can be used independently for processes that do not require a complete two-step cleaning system.
PV Wafer Post-Slicing Rough Cleaning: Removes heavy organic contaminants and bulk silicon powder from as-cut wafers, ideal for customers who use third-party fine cleaning chemicals or have lower surface quality requirements.
Used PV Wafer Recycling: Cost-effectively strips residual coatings and contaminants from end-of-life solar wafers, improving recycling efficiency and reducing material waste.
Pre-Cleaning for Wafer Inspection: Prepares wafer surfaces for visual and electrical inspection by removing surface debris, ensuring accurate defect detection.
Recommended as the primary pre-cleaning step before the texturing process.
Standard Two-Step PV Wafer Cleaning System: When followed by SPC-201B Weak Acid Fine Cleaner, delivers complete contaminant removal and optimal surface preparation for texturing, resulting in 0.3-0.5% higher solar cell conversion efficiency.
Dilution Ratio: 1:10 – 1:15 (approx. 6% – 10% concentration)
Operating Temperature: 35 – 55℃ (Recommended: 45℃)
Cleaning Method: Ultrasonic / Spray / Immersion
Cleaning Time: 4 – 8 minutes
Rinsing: Overflow rinsing with Grade 2 or above DI water
Drying: Spin drying or low-temperature drying (< 80℃)
Note for standalone use: SPC-201A is suitable for rough cleaning and inspection pre-cleaning. For texturing preparation, we recommend following with a fine cleaning step to remove residual trace metals.
Q1: What contaminants does SPC-201A remove?
A1: SPC-201A is specifically formulated to remove heavy slicing contaminants including Ingot bonding adhesives, diamond wire coolants, machining oils and bulk silicon powder particles.
Q2: Is SPC-201A safe for 182mm/210mm and beyond thin PV wafers?
A2: Yes, its mild non-corrosive formula prevents edge chipping and breakage of 130-180μm thin monocrystalline and polycrystalline photovoltaic silicon wafers.
Q3: Can SPC-201A be used alone?
A3: Yes, SPC-201A can be used alone for rough cleaning, wafer recycling and inspection pre-cleaning. For optimal texturing results, we recommend following with a fine cleaning step.
Q4: What is the recommended dilution ratio and operating temperature?
A4: The recommended dilution ratio is 1:10–1:15, and the optimal operating temperature is 35–55℃ (45℃ recommended for best results).
Q5: Can SPC-201A be used in high-volume production lines in Southeast Asia?
A5: Yes, its low-foaming formulation and long bath stability make it ideal for continuous high-volume automated production lines.
Q6: How long does the SPC-201A bath last?
A6: Under continuous production conditions, the bath typically lasts 15–25 days. Routine replenishment of 0.5%–1.0% stock solution every 8 hours maintains optimal performance.
content is empty!