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Alkaline Pre-Cleaner for DWS Solar Wafers

It is a high-performance alkaline pre-cleaner specifically formulated for DWS solar wafers, stripping heavy ingot bonding adhesives and coolants to ensure maximum production uptime.

Advantages:
  • Rapid Ingot Bonding Adhesive Removal
  • DWS Coolant Dispersion
  • Advanced Large-Format Support
  • Ultra-Thin Substrate Protection
  • Nozzle Clogging Prevention
  • Wastewater-Compliant (Fluoride-Free)
     
Packaging units: 25L/barrel, 200L/barrel, 1000L/barrel
Availability:
Quantity:
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  • SPC-201A

  • Yuanan

Product Overview: SPC-201A Alkaline Pre-Cleaner

SPC-201A is a specialized, water-based weak alkaline pre-cleaner engineered for advanced large-format and ultra-thin solar wafers in modern Diamond Wire Sawing (DWS) processes. Formulated with a mild alkaline system and advanced dispersion technology, it effectively strips residual ingot bonding adhesives and concentrated coolants without over-etching the fragile substrates. By removing 99% of heavy organic contaminants at the pre-cleaning stage, SPC-201A prevents severe nozzle clogging in high-volume production lines and provides a pristine foundation for subsequent fine cleaning and texturing processes.

Core Technical Advantages

1. Rapid Contaminant Stripping

Powered by an advanced surfactant system, it quickly dissolves stubborn ingot bonding adhesives and breaks down the high-viscosity cooling fluids used in high-speed DWS cutting, enabling higher production throughput.

2. Unmatched Line Stability & Nozzle Protection

Effectively suspends silicon powder to prevent sedimentation and redeposition. This completely eliminates nozzle blockage, reducing unplanned maintenance frequency by up to 30%.

3. Fluoride-Free Equipment & Wastewater Compliance

The non-corrosive, fluoride-free formulation protects stainless steel tanks and internal piping, extending the service life of automated cleaning tools while significantly simplifying wastewater pre-treatment.

4. Cost-Efficient Bath Longevity

Maintains consistent cleaning performance for an extended bath life of 15-25 days. With routine replenishment of only 0.5%-1.0% stock solution, it drastically lowers chemical consumption and the total cost of ownership (TCO).

5. Ultra-Thin & Large-Format Support

The mild, controlled formulation prevents micro-cracks and surface damage on fragile, ultra-thin substrates (<150μm) during high-throughput cleaning of large-format solar wafers.

Technical Specifications of SPC-201A Alkaline Pre-Cleaner

Basic Parameters

Product Model

SPC-201A

Appearance

Clear Liquid

pH (Working Solution)

9.3 – 9.7

Dilution Ratio

1:10 – 1:15 (6% – 10% concentration)

Flash Point

Non-flammable

Performance Parameters

Applicable Substrates

Monocrystalline/Polycrystalline PV Wafers

Wafer Specifications

Large-format (182/210mm+), Ultra-thin (<150μm)

Operating Temperature

35 – 55℃ (Recommended: 45℃)

Cleaning Time

4 – 8 minutes

Bath Replacement Cycle

15 – 25 days (continuous production)

Compliance Supplement

Fluoride-free, non-corrosive formulation

Application Scenarios & System Integration

1. Standalone Application

SPC-201A can be used independently for processes that do not require a complete two-step cleaning system.

  • PV Wafer Post-Slicing Rough Cleaning: Removes heavy organic contaminants and bulk silicon powder from as-cut wafers, ideal for customers who use third-party fine cleaning chemicals or have lower surface quality requirements.

  • Used PV Wafer Recycling: Cost-effectively strips residual coatings and contaminants from end-of-life solar wafers, improving recycling efficiency and reducing material waste.

  • Pre-Cleaning for Wafer Inspection: Prepares wafer surfaces for visual and electrical inspection by removing surface debris, ensuring accurate defect detection.

2. Two-Step System Integration

Recommended as the primary pre-cleaning step before the texturing process.

  • Standard Two-Step PV Wafer Cleaning System: When followed by SPC-201B Weak Acid Fine Cleaner, delivers complete contaminant removal and optimal surface preparation for texturing, resulting in 0.3-0.5% higher solar cell conversion efficiency.

Usage Guidelines & FAQs

Recommended Operation Guide

  • Dilution Ratio: 1:10 – 1:15 (approx. 6% – 10% concentration)

  • Operating Temperature: 35 – 55℃ (Recommended: 45℃)

  • Cleaning Method: Ultrasonic / Spray / Immersion

  • Cleaning Time: 4 – 8 minutes

  • Rinsing: Overflow rinsing with Grade 2 or above DI water

  • Drying: Spin drying or low-temperature drying (< 80℃)

Note for standalone use: SPC-201A is suitable for rough cleaning and inspection pre-cleaning. For texturing preparation, we recommend following with a fine cleaning step to remove residual trace metals.

Frequently Asked Questions (FAQs)

Q1: What contaminants does SPC-201A remove?

A1: SPC-201A is specifically formulated to remove heavy slicing contaminants including Ingot bonding adhesives, diamond wire coolants, machining oils and bulk silicon powder particles.

Q2: Is SPC-201A safe for 182mm/210mm and beyond thin PV wafers?

A2: Yes, its mild non-corrosive formula prevents edge chipping and breakage of 130-180μm thin monocrystalline and polycrystalline photovoltaic silicon wafers.

Q3: Can SPC-201A be used alone?

A3: Yes, SPC-201A can be used alone for rough cleaning, wafer recycling and inspection pre-cleaning. For optimal texturing results, we recommend following with a fine cleaning step.

Q4: What is the recommended dilution ratio and operating temperature?

A4: The recommended dilution ratio is 1:10–1:15, and the optimal operating temperature is 35–55℃ (45℃ recommended for best results).

Q5: Can SPC-201A be used in high-volume production lines in Southeast Asia?

A5: Yes, its low-foaming formulation and long bath stability make it ideal for continuous high-volume automated production lines.

Q6: How long does the SPC-201A bath last?

A6: Under continuous production conditions, the bath typically lasts 15–25 days. Routine replenishment of 0.5%–1.0% stock solution every 8 hours maintains optimal performance.

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