Cutting Fluid for Sapphire Crystal And Quartz Glass

a)       Sedimentation efficiency enhancement

The powder settles rapidly, extending the service life of the working fluid and significantly reducing the scratches on the workpiece.

b)       Lubrication efficiency improvement

By using high-quality lubricants, the cutting force of the tool is significantly enhanced, the surface finish of the glass is improved, and the service life of the diamond wire and the tool is effectively prolonged.

c)       Skin-friendly protection

Rich in skin care products, it is less likely to damage the skin.

d)       Rust prevention

Excellent rust prevention performance, anti-putrid performance, good product stability and long service life.

e)       Self-sharpening cleaning

It has good cleaning penetration, prevents the grinding tool from becoming passivated, and has a good self-sharpening effect on the grinding tool, enhancing the cutting force of diamond tools.

f)        Environmentally friendly water-based

Water-based transparent formula, mild performance, and less likely to cause the paint on machine tools to peel off.

a)       Quartz glass processing

suitable for milling, grinding, rolling and other processes. The product reduces processing stress through optimized lubrication performance, and achieves sub-micron surface roughness control in combination with self-sharpening technology, meeting the strict requirements of optical components and semiconductor carriers for light transmittance and flatness. The unique sedimentation system can quickly separate silica powder, avoiding secondary scratches on the workpiece surface.

b)       Sapphire diamond wire cutting

In the cutting of sapphire materials such as mobile phone screens and LED substrates, the product is compatible with diamond wire cutting technology. Its extreme pressure lubrication formula reduces the vibration of wire saws, and combined with its cleaning performance, it extends the service life of diamond grinding tools, increasing the cutting efficiency by more than 13%.

c)       Precision processing of ceramics

For the rough and fine grinding processes of electronic ceramic substrates and bio-ceramic implants, the product, through the synergies of rust inhibitors and lubricants, inhibits equipment wear caused by ceramic powder agglomeration, and the processing accuracy can reach ± 0.01mm.

d)       Silicon wafer manufacturing

It meets the edge grinding and chamfering requirements of monocrystalline silicon and polycrystalline silicon wafers. The low foam feature ensures the cooling efficiency of the diamond grinding wheel. The unique pH buffer system maintains the stability of the processing fluid, and the edge chipping rate of silicon wafers is reduced to below 0.3%.

e)       Compound process adaptation

It is compatible with three types of diamond grinding tools: sintered, electroplated and resin. It maintains stable processing parameters in complex processes such as wafer back cutting and ceramic packaging, and extends the continuous operation cycle of the equipment by 30%.

a)       Usage method: The usage varies by industry. It depends on the processing difficulty and actual situation. For details, please consult.

b)       Storage Precautions: The storage period is two years. It should not be stored outdoors and protected from direct sunlight and rain. The lid of the unused cutting fluid must be tightened to prevent water and impurities from mixing in.