UV Heat-Cured Adhesive Remover for Chip Recycling

a)       Non-Destructive to High-Value Components

Comprehensive compatibility testing confirms PL31 won't damage critical materials in precision parts:

• Optical chips/lenses: 48-hour immersion testing shows 0% loss in light transmittance (meeting general optical component standards)

• Semiconductor components: No corrosion on copper pads or silicon substrates (compliant with general electronics manufacturing quality standards)

• PCB assemblies: Maintains solder joint integrity with no delamination or discoloration

b)       Cost-Efficiency for Rework Lines

PL31 adapts to adhesive thickness, balancing performance and cost:

• Heavy UV heat-cured bonds: 1:1 to 1:5 dilution (PL31:DI water)

• Light residual bonds: 1:10 to 1:20 dilution (PL31:DI water)

c)       Global Compliance for Export

PL31 meets stringent standards for electronics manufacturing and export:

• Compliant with industry-standard RoHS requirements

• Low halogen content (Cl+Br: 120mg/kg, meeting industry low-halogen specifications) – verified by CPST Report (No. C211018067001-1)

• Low VOC (45g/L, aligning with relevant EU environmental directives)

d)       Seamless Fit with Factory Rework Equipment

PL31 works with 28–40kHz ultrasonic cleaners—standard in electronics rework stations. Its low-foam formula (foam height <5mm at 50℃) prevents nozzle clogging, reducing equipment downtime and supporting continuous rework line operations.

a)       Defective Camera Optical Chip Recycling

Pain Points: Neutral cleaners can't remove UV heat-cured bonds on optical chips; defective modules are fully scrapped, wasting high-value components.

• Solution: PL31's alkaline formula dissolves stubborn adhesives in 10min; post-removal, chips retain light transmittance (meeting general optical standards).

• Value: Enables optical chip reuse instead of full scrapping, supporting rework cost reduction.

b)       Semiconductor Component Rework

Pain Points: Stubborn epoxy bonds on defective semiconductor parts force full scrapping; strong alkaline cleaners risk damaging chip circuits.

• Solution: PL31's controlled pH (11±1) breaks down bonds without corroding copper pads or silicon substrates (compliant with general electronics standards).

• Value: Salvaged components meet reuse criteria, reducing material waste.

c)       Precision PCB Part Recovery

Pain Points: High-value PCB components (e.g., sensors) on defective boards are scrapped; neutral cleaners fail to remove heat-cured adhesives.

• Solution: PL31 and 30kHz ultrasonic cleaning removes bonds in 8min; no damage to PCB solder joints.

• Value: Recovers reusable parts, aligning with sustainable manufacturing goals.

Preparation

  1. Dilute PL31 based on adhesive thickness:

•   Heavy UV heat-cured bonds: 1:1 to 1:5 (PL31:DI water), stir 30s until uniform.

•   Light residual bonds: 1:10 to 1:20 (PL31:DI water).

  2. Preheat ultrasonic cleaner to 50–60℃; confirm frequency (28–40kHz) to avoid component damage.

Operation

• Ultrasonic (Rework Lines): Submerge components in diluted PL31; run ultrasound 8–12min. For thick bonds, extend 2–3min (monitor to avoid overexposure).

• Manual (Small Batches): Use lint-free cloth to apply diluted PL31; let sit 5–8min; gently peel bonds; rinse with DI water.

Post-Treatment

1. Rinse components 2–3x with DI water (30s each) to remove residual PL31.

2. Dry: 60–70℃ oven (5min) or air-dry (30min) – avoid high temperatures that damage chips.

3. Inspect: Test component functionality (e.g., optical transmittance, electrical resistance) per general electronics manufacturing standards.

FAQ:

Q1: When should we use PL31 instead of neutral cleaners?

A1: PL31 is intended for stubborn UV heat-cured adhesives that neutral cleaners can't dissolve—e.g., when recycling defective optical chips or semiconductor parts. It's a targeted solution, not a replacement for routine neutral cleaning.

Q2: Will PL31 damage optical chip coatings?

A2: No. It passed 48-hour immersion tests with AR-coated optical chips (meeting general optical standards), showing 0% coating peeling or transmittance loss—safer than strong alkaline alternatives.

Q3: Is PL31 suitable for high-volume rework lines in Southeast Asia?

A3: Yes. Its compatibility with 28–40kHz ultrasonic cleaners (standard in regional factories) and industry-standard RoHS compliance support export-oriented production. Local manufacturers have used it to reduce reliance on full scrapping of defective components.

Q4: Can diluted PL31 still preserve component functionality?

A4: Yes. Even at 1:20 dilution, it maintains 97.8% adhesive removal efficiency and ≥99.5% component functionality retention (per general electronics standards), balancing cost and performance.

Q5: Does PL31 require special storage to maintain effectiveness?

A5: Store unopened at 15–30℃ (dry, no direct sunlight) for 12 months. After opening, seal tightly and use within 3 months—no impact on pH or performance when stored properly.