Muhimman Matsayin Ma'aikatan Tsigewa a Microfabrication
A cikin duniyar semiconductor da masana'antar lantarki, daidaito ba zai yuwu ba. Ɗaya daga cikin matakan da ya fi dacewa a cikin wannan babban tsari mai girma shine photolithography, wanda ya haɗa da yin amfani da hoton hoto don ayyana yanayin da'irar microscopic akan wafer silicon. Amma da zarar an yi etching ko ion implantation, saura photoresist dole ne a cire gaba daya. Anan shine photoresist tube jamiái zama ba makawa.
Babban aikin cirewa mai ɗaukar hoto yana tabbatar da tsabtataccen saman ƙasa, yana hana gurɓatawa, kuma yana kare mutuncin wafer. Ba tare da ingantacciyar hanyar cirewa ba, lahani da ragowa na iya yin lahani ga aikin samfur na ƙarshe, musamman a cikin ci-gaba na fasahar node semiconductor.
Haɗe-haɗe da Chemistry Bayan Wakilan Tsige Zamani
Keɓance Tsari don Bukatu Daban-daban
Ba duk kayan aikin hoto ba ne aka ƙirƙira daidai - kuma ba su zama wakilai masu cirewa ba. Ƙirƙirar ƙira ta haɗa nau'ikan sinadarai masu aiki da suka haɗa da amines, hydroxylamine, kaushi, masu hana lalatawa, da masu hana lalata don daidaita aiki tare da aminci na ƙasa. Wakilan tsige mallakar mallakar Yuanan, alal misali, an ƙera su zuwa:
Narkar da taurare ko masu haɗe-haɗe,
Rage lalata ƙarfe akan aluminum, jan karfe, da yadudduka na zinariya,
Tabbatar da dacewa tare da kayan lantarki masu mahimmanci kamar ƙananan-k fina-finai.
Wasu abubuwan cirewa suna dogara ne akan ruwa, yayin da wasu suka dogara da dabaru masu nauyi, ya danganta da nau'in juriya da kayan da ke ƙasa. Dabarar ta ta'allaka ne a cikin ƙirƙira samfurin da ke tsiri gaba ɗaya yayin da babu ragowar ionic ko ƙarfe a baya.
Me Yasa Zabar Wakilin Tsige Da Ya dace
Dacewar Tsari Shine Maɓalli
Matakan cirewa mara kyau na photoresist na iya haifar da asarar yawan amfanin ƙasa. Don haka, dacewa tare da takamaiman matakai na etch, matakan dasa shuki, ko ƙananan-k kayan yana da mahimmanci. Maganin Yuanan an gwada su sosai don dacewa a cikin matakai daban-daban na ƙirƙira wafer - daga layukan CMOS na al'ada zuwa sassaukan lithography na EUV.
Ƙarfin Cire : Tauraro har ma da taurin gaske yana jurewa da sauri.
Zaɓin Abu : Yana barin fina-finan da ba su da kyau.
Tsabtace Faɗa : Yana hana sake fasalin ƙarfe da samuwar ragowar.
Ƙarfafawar thermal : Yanayi a yanayin yanayin tsari daban-daban.
Yarda da Muhalli : Ƙananan VOCs da ƙayyadaddun ƙirar halitta idan zai yiwu.
Maɓallin Aikace-aikace a Gaba ɗaya Masana'antar Semiconductor
Daga kwakwalwan kwakwalwan kwamfuta da na'urorin ƙwaƙwalwar ajiya zuwa MEMS da mahaɗan semiconductor, Masu cirewa masu ɗaukar hoto suna yin ayyuka masu mahimmanci. Amfani da su bai keɓance ga matakin lithography guda ɗaya ba. Ana shafa su bayan:
ion implantation (inda resists ya zama sosai carbonized),
Plasma etching (wanda zai iya haifar da taurin bangon gefe),
Dual damascene matakai (buƙatar cire zaɓi ba tare da tayar da hankalin dielectric tari ba).
A cikin marufi na ci-gaba, musamman marufi-fito wafer-level packaging (FOWLP), ƙwaƙƙwaran sinadarai dole ne su kare wafers masu bakin ciki da manyan yadudduka na sake rarrabawa. Yuanan ya ƙirƙira dabarun da aka tsara musamman don waɗannan ƙalubale na zamani.
Kalubale na gama gari a cikin Tsagewar Hoto-da Yadda Ake Cire Su
Matsalolin da suka saura a cikin Nodes na Babba
Yayin da geometries na na'ura ke raguwa a ƙasa da 5nm, fina-finai masu tsayayya sun zama masu raɗaɗi amma sun fi rikitarwa a cikin ilmin sunadarai, sau da yawa suna fuskantar tauri saboda bayyanar plasma. Waɗannan canje-canje na iya haifar da kaushi na gargajiya don yin ƙasa. Manyan jami'ai na Yuanan suna kai hari ga waɗannan ragowar ta hanyar tsarin aiki biyu - kumburi da narkar da - wanda ke biyo baya ta hanyar wankewa sosai.
Lalata da Lalacewar Abu
Abubuwan cirewa waɗanda ke ƙunshe da amines masu ƙarfi ko acid mai ƙarfi na iya lalata ƙarfe kamar jan ƙarfe ko aluminum. Abubuwan da aka hana lalatawar Yuanan suna adana yadudduka masu mahimmanci, ko da a ƙarƙashin tsawaita yanayin jiƙa, suna taimakawa kula da aikin lantarki da tsarin saman ƙasa.
Ƙaddamarwa da Ƙarfin Kuɗi
Tare da masana'anta na semiconductor da ke neman mafi girma kayan aiki, tsari da rigar benci mai wafer ɗaya dole ne a inganta su. Maganganun Yuanan sun ƙunshi lokutan cirewa da sauri, rage lokacin jiƙa da ƙyale fabs don kula da fitarwa mai girma ba tare da lalata inganci ba.
Rigar Rigar vs. Plasma Ashing: Zaɓin Dabaru
Yayin da busasshiyar tokawar plasma wata hanya ce don tsayayya da cirewa, galibi yana raguwa tare da gasa mai tauri ko tauraruwar dasa. Rike sinadaran jika ta amfani da manyan ayyuka kamar waɗanda Yuanan ya haɓaka shine:
Ingantacciyar inganci don kauri ko yadudduka masu alaƙa
Ƙarƙashin lalacewa ga ƙananan ƙananan-k ko maɗaukaki mai laushi
Yana da kyau a share ragowar a cikin babban al'amari rabo fasali
Yawancin fabs suna ɗaukar hanyar haɗaɗɗiyar hanya: tokawar plasma ta farko ta biyo bayan rigar rigar, yana tabbatar da cire gabaɗaya tare da ƙarancin lalacewa.
Kammalawa
A cikin masana'antar semiconductor mai saurin haɓakawa, zabar daidai Wakilin cirewa mai ɗaukar hoto ba kawai yanke shawara ne na fasaha ba - dabara ce. Tare da fiye da shekaru goma na gogewa a cikin ingantattun sinadarai da haɗin gwiwa tare da injiniyoyin fasaha a duk duniya, Yuanan yana ba da tabbaci, aminci, da aiki wanda bai dace ba.
Ko kana sarrafa zurfin-UV taurin juriya ko magance sharancin hoto na gaba na EUV, ƙirar Yuanan na ci gaba an gina su don fuskantar ƙalubalen. Ku isa yau don gano yadda za mu iya inganta tsarin kawar da adawarku - da haɓaka yawan amfanin ku, aiki, da sawun muhalli.
